soldering should be 100°C or less. * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. High Port Density By. Section 7 Environmental and Temperature – added a “custom” temperature class for modules that do not comply with any of the legacy case temperature ranges, e., hyperscale data center applications. Major updates to Table 8-1 including re-writes of many entries in the “Conditions” column. The MSL reclassification is performed on the largest die size that is used in the package. Reduce traffic load (if possible): Lowering utilization can reduce thermal. Telcordia NEBSTM Requirements: Physical Protection GR-63 CORE outlines the temperature range for a touchable surface in normal use (short periods) as 55°C for a metal surface and 70°C for non-metals such as the pull handle of the module. Parts that are held in normal use (prolonged use) are. It is imperative to understand how to address SFP module temperature fluctuations in order to keep your network properties stable and minimize any risky ventures with your investment.
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