JCET offers the broadest portfolios of comprehensive packaging and test services in the semiconductor industry and can leverage its strong packaging and test capabilities to provide a full turnkey solution of integrated packaging, testing, and direct shipment to end customers. April 21, 2026 -- Driven by the surging demand for High-Performance Computing (HPC) and high-density storage, high-end advanced packaging has emerged as a primary catalyst for the evolution of the semiconductor industry. Capitalizing on this momentum, JCET Group has significantly accelerated its. Driving the Future of Data Connectivity with Co-Packaged Optics (CPO) JCET's latest CPO packaging solutions deliver higher bandwidth, lower power, and improved signal integrity — enabling next-generation performance for computing, communications, and automotive applications. By integrating optical. Founded in 1972, JCET Group is the world's leading integrated circuit manufacturing and technology services provider. JCET Group primarily serves sectors such as mobile, communication, compute, consumer, automotive, and industrial.
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According to our latest research, the Ethernet Core Switch market size reached USD 13. 2 billion globally in 2024, reflecting robust demand across data-intensive industries. The market is expected to expand at a CAGR of 7. Core switches are not a type of switches, but switches placed at the core. The global data center switch market was valued at US$ 16. It enables instant data exchange worldwide and powers everyday activities like emailing, browsing, streaming, and online gaming.
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